News and Events

Tetrivis tapes out prototype Transmit and Receive Phased-Array Silicon Chipsets for Low-Cost Terminals for Emerging Low-Earth Orbit Satellite (LEOSAT) Market

30th September 2020, Basingstoke, UK – Tetrivis LTD, a provider of specialist Analogue, Mixed-Signal, RF and mm-Wave Intellectual Property, has today taped out the TRV003 (Rx) and TRV004 (Tx) RF/mm-Wave Integrated Circuits for fabrication, the first chipsets in the KuKa™ family of Phased Array ASICs. TRV003 supports four Ku-Band Dual-Beam Dual-Polarisation RF-to-Baseband paths while TRV004…
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TRV107TSM180BCD 1.8V low-power 32MHz single-bit switched-capacitor Delta-Sigma Modulator is now available

Silicon-proven and available for licensing! The TRV107TSM180BCD IP is a 1.8V low-power 32MHz single-bit switched-capacitor Delta-Sigma Modulator (7.8125kHz-to-62.5kHz-Nyquist-rate) implemented in TSMC Low-Power 180nm CMOS process technology. Its 13-bit performance makes it suitable for use in high-performance wireless/wireline sensor interface, fine-line Instrumentation and Internet-of-Things integrated circuit subsystems (WSN, BAN, IoT).

TRV106TSM180BCD 180nm 13-bit ∆Σ ADC IP now available

The TRV106TSM180BCD IP is a 1.8V low-power 32MHz single-bit switched-capacitor ∆Σ Modulator-based 7.8125kHz-to-62.5kHz-Nyquist-rate ADC with programmable Decimation Rate and implemented in TSMC Low-Power 180nm CMOS process technology. Its 13-bit performance makes it suitable for use in high-performance wireless/wireline sensor interface, fine-line Instrumentation and Internet-of-Things integrated circuit subsystems (WSN, BAN, IoT).

Frontier digital radio sales exceed 45 million units

Earlier in the year, Frontier Smart Technologies, a leading supplier of digital audio solutions, announced that lifetime sales of the Group’s digital radio chips and modules have now exceeded 45 million units. Tetrivis is proud to have its TRV103GFY40LP ADC IP on board the Kino-4 chip.

Shanghai FD-SOI/RF-SOI Event

Many players in the Industry including Amazon/ Blink and Intellifusion are pushing boundaries by taping out their new chipsets on Samsung’s 28FDS FD-SOI and Global Foundries’ 22FDX FD-SOI technologies.

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